I have two cases for my Pi5 - an armor case with constant dual fans and one with a PWM fan. Now, I'm happy with the performance of both but I noticed the bottom plate doesn't actually heat up a lot.
I ran a few stress tests and the part that heats up the most is the top part. Now this makes sense since the heat sink is actively connected to the cpu via the thermal tape. I also ran a reverse test on the unmounted case - I sprayed the top with liquid butane. It cooled down substantially but the bottom part never did.
I have some extra tape and I could stack it enough to reach the CPU from the bottom side. However, judging by all the components on the underside, I'm a bit flustered by the concept. I've read some claims that thermal tape could potentially act as a 'capacitor' and short the components. I don't actually know.
What do you think?
I ran a few stress tests and the part that heats up the most is the top part. Now this makes sense since the heat sink is actively connected to the cpu via the thermal tape. I also ran a reverse test on the unmounted case - I sprayed the top with liquid butane. It cooled down substantially but the bottom part never did.
I have some extra tape and I could stack it enough to reach the CPU from the bottom side. However, judging by all the components on the underside, I'm a bit flustered by the concept. I've read some claims that thermal tape could potentially act as a 'capacitor' and short the components. I don't actually know.
What do you think?
Statistics: Posted by frank7 — Tue May 14, 2024 5:38 pm — Replies 5 — Views 150